Non abrasive processing
3M™ Boron Nitride Cooling Fillers’ dry lubrication properties and low hardness (1 – 2 on the Mohs scale) ensure non-abrasive processing even at the highest filling levels. In contrast, conventional thermally conductive additives can have a hardness of up to 9 on the Mohs scale. Often, the effects of these additives only become apparent during serial production and exhibit as high abrasion to tools and systems as well as poor process stability. The resulting costs often outweigh the potential savings in raw material costs.
Low compounding costs
3M™ Boron Nitride Cooling Filler Platelets 15/400 were developed for screw type extrusion, which allows high production efficiency and process consistency. Due to the high bulk density and pourability, dusting is also prevented. For filling levels of over 30 vol-%, these properties are decisive for process costs and process stability. The power consumption during extrusion and thus the energy costs are drastically reduced in comparison to alternative, non-lubricating filling materials.
Combination with secondary filling materials
Due to the low required filling level when using 3M™ Boron Nitride Cooling Filler Platelets, compound developers have leeway to combine it with additional secondary filling materials. This can reduce raw material costs. For example, properties like mechanical strength can be achieved by adding glass fibers.
Short cool-down times
The extremely high thermal conductivity in Boron Nitride filled thermoplastics can result in shorter cool-down times for injection molding tools. Overall cycle time reductions of >30 % have been achieved. The excellent heating and quick cool-down can also be applied economically in compounding.
Environment and safety
The boron nitride powders contained in 3M™ Boron Nitride Cooling Filler (all grades) have been duly registered in conformance with REACH obligations according to EC directive 1907/ 2006 (Registration number see MSDS). The products do not contain any SVHC substance of the actual SVHC candidate list above a concentration of 0.1 % (w/w).
Boron Nitride the white graphite as an insulator and heat conductor
Hexagonal boron nitride
Hexagonal boron nitride (hBN) is manufactured synthetically from the raw materials melamine and boric acid. In an additional high-temperature glowing process, a hexagonal platelet structure develops – comparable to graphite. This also explains the advantageous properties like high heat conductivity and good lubrication due to layer gliding. In contrast to graphite, hBN has a pure white color and is not electrically conductive.
3M™ Boron Nitride Cooling Filler Platelets 15/400 the solution for thermally conductive compounds
3M™ Boron Nitride Cooling Filler Platelets 15/400 is a simple and process reliable additive that allows thermal conductivity levels of up to 15 W/m*K to be achieved. Non-agglomerated hBN products cannot be processed economically with any process-reliability in compounding due to the low bulk density and lack of pourability. For filling levels >20 vol-%, the conveying characteristics of the filling material generally determine the economic feasibility of the process. The product Cooling Filler Platelets 15/400 is highly agglomerated and distinguishes itself through excellent pourability and high bulk density, and prevents processing problems linked to dusting. Even filling levels of over 50 % can be processed with economic throughputs and process-reliably in conventional extrusion systems. The agglomerates dissolve in the melted polymer mass even at low shear in individual platelets of approx. 15 μm which are necessary for achieving high thermal conductivity levels. Even at filling levels over 50 %, a good dispersion is achieved. Simple gravimetric side dosing is sufficient for common compound recipes.